JPS5376942A - Flux composition - Google Patents

Flux composition

Info

Publication number
JPS5376942A
JPS5376942A JP10638177A JP10638177A JPS5376942A JP S5376942 A JPS5376942 A JP S5376942A JP 10638177 A JP10638177 A JP 10638177A JP 10638177 A JP10638177 A JP 10638177A JP S5376942 A JPS5376942 A JP S5376942A
Authority
JP
Japan
Prior art keywords
flux composition
flux
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10638177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5546799B2 (en]
Inventor
Uiriamu Hansu Shiyu Fuiritsupu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5376942A publication Critical patent/JPS5376942A/ja
Publication of JPS5546799B2 publication Critical patent/JPS5546799B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP10638177A 1976-12-20 1977-09-06 Flux composition Granted JPS5376942A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/752,337 US4077815A (en) 1976-12-20 1976-12-20 Water soluble flux

Publications (2)

Publication Number Publication Date
JPS5376942A true JPS5376942A (en) 1978-07-07
JPS5546799B2 JPS5546799B2 (en]) 1980-11-26

Family

ID=25025878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10638177A Granted JPS5376942A (en) 1976-12-20 1977-09-06 Flux composition

Country Status (5)

Country Link
US (1) US4077815A (en])
JP (1) JPS5376942A (en])
DE (1) DE2741312A1 (en])
FR (1) FR2374129A1 (en])
GB (1) GB1537021A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257795A (ja) * 1985-09-04 1987-03-13 Electroplating Eng Of Japan Co 水溶性フラツクス
WO1999001251A1 (en) * 1997-07-03 1999-01-14 Matsushita Electric Industrial Co., Ltd. Solder paste
US6159304A (en) * 1997-07-03 2000-12-12 Matsushita Electric Industrial Co., Ltd. Solder paste

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE457335B (sv) * 1984-07-20 1988-12-19 Ytkemiska Inst Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet
US4547304A (en) * 1984-08-30 1985-10-15 Texaco, Inc. Nonfuming solder cleansing and fusing fluids
US4568395A (en) * 1985-05-10 1986-02-04 Nabhani Abdol R Precleaner system and soldering flux
JPS6388085A (ja) * 1986-10-02 1988-04-19 Toyo Kohan Co Ltd めつき鋼板の後処理方法
DE3714268A1 (de) * 1987-04-29 1988-11-10 Basf Ag Flussmittel und umschmelzfluessigkeiten und die verwendung von alkylenoxid-addukten in flussmittel und umschmelzfluessigkeiten
DE3734331A1 (de) * 1987-10-10 1989-04-27 Basf Ag Verwendung von alkylenoxid-addukten in flussmitteln und umschmelzfluessigkeiten
JPH058085A (ja) * 1990-11-30 1993-01-19 Nippondenso Co Ltd はんだ付け用フラツクス
DE4131950A1 (de) * 1991-09-25 1993-04-01 Boehme Chem Fab Kg Produkte als flussmittel und umschmelzfluessigkeiten bei der herstellung von leiterplatten
US5215602A (en) * 1992-05-29 1993-06-01 At&T Bell Laboratories Water-soluble flux
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
DE19545676A1 (de) * 1995-12-07 1997-06-12 Wack O K Chemie Gmbh Verfahren zum Aktivieren von Leiterplatinen
WO2015037107A1 (ja) * 2013-09-12 2015-03-19 千住金属工業株式会社 洗浄用フラックス、洗浄用ソルダペースト及びはんだ継手
CN108687463B (zh) * 2017-03-30 2021-09-21 株式会社田村制作所 预涂层用焊料组合物、印刷布线基板的制造方法、焊料组合物及电子基板的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436278A (en) * 1966-08-08 1969-04-01 Ibm Glycol soldering fluxes
US3589952A (en) * 1968-07-05 1971-06-29 Olin Mathieson Slurry for brazing metal surfaces
US3597285A (en) * 1969-05-02 1971-08-03 Lake Chemical Co Flux for use in soldering of stainless steels
US3832242A (en) * 1970-07-23 1974-08-27 Scm Corp Brazing and solder compositions comprising a chelating agent
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
US3865641A (en) * 1972-01-14 1975-02-11 Lake Chemical Co Compositions for use in soldering stainless steels
US3791879A (en) * 1973-05-21 1974-02-12 Rockwell International Corp Solder flux composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257795A (ja) * 1985-09-04 1987-03-13 Electroplating Eng Of Japan Co 水溶性フラツクス
WO1999001251A1 (en) * 1997-07-03 1999-01-14 Matsushita Electric Industrial Co., Ltd. Solder paste
US6159304A (en) * 1997-07-03 2000-12-12 Matsushita Electric Industrial Co., Ltd. Solder paste
CN1104303C (zh) * 1997-07-03 2003-04-02 松下电器产业株式会社 钎料膏

Also Published As

Publication number Publication date
FR2374129A1 (fr) 1978-07-13
DE2741312A1 (de) 1978-06-29
US4077815A (en) 1978-03-07
JPS5546799B2 (en]) 1980-11-26
FR2374129B1 (en]) 1980-12-19
GB1537021A (en) 1978-12-29

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